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(SOLD) 2019 ERSA HOTFLOW 3/20 PCB SOLDER REFLOW OVEN

Description

2019 ERSA HOTFLOW 3/20 PCB REFLOW OVEN 


EQUIPMENT HAS SOLD


DOM:06/2019 

Power: 3x400 V  


Basic configuration

  • 7 top-side preheating zones,
  • 3 top and bottom-side peak zones
  • Cooling step 1,
  • basic cooling from the top and bottom side
  • Adjustable fan speed (cooling and peak zone)
  • Temperature monitoring of the cooling zone
  • Top and bottom-side motor cooling
  • Energy consumption management
  • Automatic chain lubrication
  • 100% tested process tunnel (gas sealed)
  • Heating and cooling modules retractable
  • without any tools
  • Best temperature transmission for a wide variety of flat modules
  • Residual oxygen control with low N2 consumption
  • Low energy consumption through intelligent energy management
  • Multistage controlled cooling
  • Multi-stage process gas cleaning system
  • “On the fly” maintenance for increased machine availability
  • Multitrack transport systems
  • Ersa Process Control (EPC) for continuous process monitoring
  • Ersa Autoprofiler software for instant temperature profile finding



    • Ovens are in like new condition and are ready to ship ASAP.

    Specifications

    ManufacturerKURTZ ERSA Solder Reflow Oven's
    ConditionUsed