Dimensions (basic machine):
Length:2,300 mm [91"]
Width:1,730 mm [68"]
Height:1,612 mm [63"
Weight:approx. 900 kg [1,984 lbs]
Paint:RAL 7035 / 7016
Conveyor system:Pin-and-chain conveyor for PCB transport
Conveyor angle:0° fix
PCB width (Single Track):63.5 - 406 mm [2.5 - 16"
PCB length:127 - 508 mm [5 – 20"]
PCB top-side clearance: 60 - 120 mm [2 - 5"] (basic machine) (measured from PCB bottom side, except PCB edges 3 mm [0.3"])PCB bottom-side clearance:max. 60 mm [2"] (subject to soldering joint position)
Clearance from PCB edge:5 mm [0.1"]
Conveyor height from floor:850/950 mm, ±25 mm [33"/37" ±1"]
Conveyor speed:2 - 10 m/min [7 - 33'/min]
Pallet/PCB weight:max. 8 kg [18 lbs]
Flux module:Precision spray fluxer installed on joint axes system
Flux tank:2l
Positioning speed: 2 - 200 mm/s [0.04 - 8"/s]
Positioning accuracy:±0.25 mm [±0.01"]
Spray width:2 - 8 mm [0.08 - 0.3"] (130 μm nozzle)
Preheat module (option):
Dynamic bottom-side infrared emitters: max. 12 kW
Temperature range:0 - 200 °C [32 - 392 °F] (power adjusted)
Dynamic top-side convection heater: 6 kW
Stainless steel solder pot, integrated in a 3-axes positioning system (X/Y/Z), servo motor driven
Solder nozzle:Single-Point high-precision nozzle
Smallest solder nozzle diameter:OD 4.5 mm [0.2"] (further nozzles on request
Wave height:max. 5 mm [0.2"]
PCB clearance:min. 5 mm [0.2"]
Solder volume:approx. 13 kg [29 lbs] (Sn63Pb); approx. 12 kg [26 lbs] (lead-free alloy)
Solder temperature:max. 320 °C [608 °F]
Heating time:75 min (to 280°C) [to 536 °F]
Positioning speeds:X/Y: 2 - 200 mm/s [0.08 - 8"/s]; Z: 2 - 100 mm/s [0.08 - 4"/s]
Soldering speed:2 - 100 mm/s [0.08 - 4"/s]
Positioning accuracy:±0.25 mm [±0.01"]
Nitrogen technology:
Nitrogen supply:to be supplied locally
Nitrogen injection:N2 cover over the solder bath
Required pressure:4 bar [58 PSI]
Nitrogen consumption:approx. 1.5 m3/h [53 ft3/h] per solder pot
Particle cleanliness:5.0 recommended
Pneumatic system:Compressed air supply:
to be supplied locally
Required pressure:6 bar [87 PSI]
Consumption:< 5 m3/h [< 177 ft3/h]
Computer-based microprocessor (state-of-the-art control technology)
Process visualization
Input of all process parameters
7 day time clock
Machine status control
Password function
Production-, process- and traceability data recording
Electrical data:
Power:5-wire system, 3 x 230/400 V, N, PE
Power tolerance range:±5 %
Frequency:50/60 Hz
Power consumption:19 kW (basic machine incl. bottom-side preheating system)
Max. fuse rating:3 x 35A
Machine exhaust (basic machine)
Exhaust stack:1 pc., OD 150 mm [6"]
Exhaust volume per stack:150 m3/h [196 yd3/h]
Ambient conditions / noise level
Ambient temperature:15 - 35 °C [59 - 95 °F]
Permanent noise level:< 60 dB (A)
Basic design & construction:
Solid steel construction
Security glass windows
Emergency-Stop button
Length:2,300 mm [91"]
Width:1,730 mm [68"]
Height:1,612 mm [63"
Weight:approx. 900 kg [1,984 lbs]
Paint:RAL 7035 / 7016
Conveyor system:Pin-and-chain conveyor for PCB transport
Conveyor angle:0° fix
PCB width (Single Track):63.5 - 406 mm [2.5 - 16"
PCB length:127 - 508 mm [5 – 20"]
PCB top-side clearance: 60 - 120 mm [2 - 5"] (basic machine) (measured from PCB bottom side, except PCB edges 3 mm [0.3"])PCB bottom-side clearance:max. 60 mm [2"] (subject to soldering joint position)
Clearance from PCB edge:5 mm [0.1"]
Conveyor height from floor:850/950 mm, ±25 mm [33"/37" ±1"]
Conveyor speed:2 - 10 m/min [7 - 33'/min]
Pallet/PCB weight:max. 8 kg [18 lbs]
Flux module:Precision spray fluxer installed on joint axes system
Flux tank:2l
Positioning speed: 2 - 200 mm/s [0.04 - 8"/s]
Positioning accuracy:±0.25 mm [±0.01"]
Spray width:2 - 8 mm [0.08 - 0.3"] (130 μm nozzle)
Preheat module (option):
Dynamic bottom-side infrared emitters: max. 12 kW
Temperature range:0 - 200 °C [32 - 392 °F] (power adjusted)
Dynamic top-side convection heater: 6 kW
Stainless steel solder pot, integrated in a 3-axes positioning system (X/Y/Z), servo motor driven
Solder nozzle:Single-Point high-precision nozzle
Smallest solder nozzle diameter:OD 4.5 mm [0.2"] (further nozzles on request
Wave height:max. 5 mm [0.2"]
PCB clearance:min. 5 mm [0.2"]
Solder volume:approx. 13 kg [29 lbs] (Sn63Pb); approx. 12 kg [26 lbs] (lead-free alloy)
Solder temperature:max. 320 °C [608 °F]
Heating time:75 min (to 280°C) [to 536 °F]
Positioning speeds:X/Y: 2 - 200 mm/s [0.08 - 8"/s]; Z: 2 - 100 mm/s [0.08 - 4"/s]
Soldering speed:2 - 100 mm/s [0.08 - 4"/s]
Positioning accuracy:±0.25 mm [±0.01"]
Nitrogen technology:
Nitrogen supply:to be supplied locally
Nitrogen injection:N2 cover over the solder bath
Required pressure:4 bar [58 PSI]
Nitrogen consumption:approx. 1.5 m3/h [53 ft3/h] per solder pot
Particle cleanliness:5.0 recommended
Pneumatic system:Compressed air supply:
to be supplied locally
Required pressure:6 bar [87 PSI]
Consumption:< 5 m3/h [< 177 ft3/h]
Computer-based microprocessor (state-of-the-art control technology)
Process visualization
Input of all process parameters
7 day time clock
Machine status control
Password function
Production-, process- and traceability data recording
Electrical data:
Power:5-wire system, 3 x 230/400 V, N, PE
Power tolerance range:±5 %
Frequency:50/60 Hz
Power consumption:19 kW (basic machine incl. bottom-side preheating system)
Max. fuse rating:3 x 35A
Machine exhaust (basic machine)
Exhaust stack:1 pc., OD 150 mm [6"]
Exhaust volume per stack:150 m3/h [196 yd3/h]
Ambient conditions / noise level
Ambient temperature:15 - 35 °C [59 - 95 °F]
Permanent noise level:< 60 dB (A)
Basic design & construction:
Solid steel construction
Security glass windows
Emergency-Stop button